Job description
Description
About Macnica:
Macnica Americas, Inc. is the North American division of Macnica Fuji Electronics Holdings, Inc. a $10 billion technology solutions provider with a stronghold in semiconductor distribution. Macnica excels in customizing solutions to client requirements and leveraging skilled engineers to expedite product development without compromising outcomes for our clients.
Learn more about the Macnica team members you’ll be joining!
Company perks:
15 days of vacation, plus 12 days of national holidays
40 hrs. of paid sick time off
Health, dental, and vision insurance
401 (k) with company matching
HSA/ FSA
Job Summary:
The Field Application Engineer (FAE) will primarily support customers in the broad market (ranging from early stage/start ups to Fortune 50) companies in the electronics industry by assisting in their design and development processes. The FAE is responsible for identifying new opportunities, deeply understanding customer requirements, and proposing tailored solutions that align with those needs. This role involves explaining semiconductor product roadmaps and specifications provided by manufacturers to secure customer projects. Additionally, the FAE will establish and maintain strong relationships with key customers, working closely with their technical teams and collaborating with semiconductor manufacturers’ technical teams and solution partners to comprehensively support the customers’ design and development processes.
Duties/Responsibilities:
Opportunity Identification and Support: Engage customers to identify new project opportunities. Understand the challenges in their design and development processes and capture detailed requirements. Present and explain the relevant semiconductor product roadmaps and specifications from manufacturers and solution partners, offering solutions that meet the customer’s needs and leading to project acquisition.
Technical Advice and Project Support: Utilize in-depth knowledge of semiconductors and related products to provide customers with optimal solutions. This includes offering product demonstrations, evaluation boards, and design support. Work closely with the manufacturer’s technical teams to enhance the technical advice provided to customers. Additionally, deliver training sessions to educate customers on technical aspects.
Project Management: Manage multiple projects simultaneously, each involving different manufacturers, design partners, and customers. Allocate resources according to the specific needs of each project. Oversee project timelines, ensuring that all deadlines are met. Establish criteria to evaluate business success and conduct regular design review meetings with internal Sales and supplier teams, preparing and presenting necessary documentation.
Customer Relationship Management: Regularly visit the technical departments of customers to build strong, trusting relationships. Understand and address their needs and challenges, providing appropriate technical support that fosters long-term partnerships. Domestic travel is expected approximately once a week, with occasional international travel possible.
Technical Training Provision: Collaborate closely with manufacturers to develop and deliver technical training to customers and internal technical teams. These training sessions will ensure that both customers and internal teams are well-equipped with the knowledge needed to fully leverage the semiconductor products being used.
Reporting and Documentation: Regularly report on the progress and challenges of each project. Prepare comprehensive project summaries, including schedules, specifications, prices, block diagrams, and organizational charts, and share these with appropriate stakeholders. Create documentation for regular design review meetings, facilitating effective information sharing with manufacturers and internal teams.
Requirements
Technical Requirements:
Securing Wins for supplier’s Target Products: A primary objective is to secure design wins for key semiconductor on our line card with a focus on: FPGAs, imaging sensors, AI acceleration solutions, embedded design and Single Board Computers.
Customer Engagement: Ability to understand and resolve the technical challenges of customers efficiently, covering the full spectrum from opportunity identification to project management.
Project Management Skills: Capable of managing multiple projects involving different manufacturers and customers, with a focus on prioritizing resources effectively and meeting project deadlines.
Communication Skills: Excellent ability to explain technical content clearly and collaborate effectively with both internal and external stakeholders.
Preferred Qualifications:
Experience in one or more of the following verticals: ProAV and Broadcast, Mobility, Robotics, Medical, Imaging.
Sales and Marketing Experience: Experience in technical support and product introduction activities is a plus.
Other Information
Travel: North American travel is expected (approximately 25% of the time) international travel may be required from time-to-time.
Education and Experience:
Electronics Degree or Diploma
Experience:
· 5-10 years FAE experience within the semiconductor industry
· 3 years+ embedded software technical support preferred
